William J. Greig: Integrated Circuit Packaging, Assembly and Interconnections

Integrated Circuit Packaging, Assembly and Interconnections



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Author: William J. Greig
Number of Pages: 300 pages
Published Date: 29 Oct 2010
Publisher: Springer-Verlag New York Inc.
Publication Country: New York, NY, United States
Language: English
ISBN: 9781441939234
Download Link: Click Here
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